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Electromagnetic Shielding Engineering for Wired and Wireless Communications and Electronics |
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| Content | Syllabus |Further Information | Lecturer | Registration | |
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| TECHNOLOGY FOCUS
Electromagnetic shielding uses and benefits are as ubiquitous as electricity and electronics in modern society. It is important to understand how to use this EMI control technique in the most economic and efficient ways to assure interference-free products and systems in industrial and military, consumer and business, scientific and medical environments, as well as compliance with stringent EMC regulations. |
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COURSE CONTENT
This advanced level comprehensive course takes the “black magic” shroud off electromagnetic shielding. Both beginners and seasoned professionals will find to their amazement, that shielding is often not at all what they thought.The emphasis is made on explanation of the physical phenomena and real life applications. A “nuts and bolts” practical competence is developed using lecture material, demonstrations, simulations, and workshops, while the mathematical background and specific details can be found in the recommended textbook.
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COURSE SYLLABUS
Monday
Understand Shielding
The review and analysis of the existing shielding theories, definitions, and units, reveal their limitations and ineffectiveness - how about 3000 dB errors? Based on the system approach to the EMI channel, we identify shielding processes and determinants, and develop scientific principles of shielding system engineering for EMI control. The Series System Model of shielding addresses the shielding environment effects, EMI coupling and propagation mechanisms, shield transfer function and its parallel model.We will explain the basic concept of transfer impedance and use it to characterize practical shields.
- Dispelling Shielding Myths and Fallacies
- Defining Shielding: System view
- Developing and Investigating the Shielding Series Model
- Shielding Determinants
- Shielding Environment and Coupling
- Shield Transfer Function and Transfer Impedance
- Case Studies
Workshop: Testing shielding theories
Tuesday
Transfer Function of Shielding Enclosures
We will investigate the design versus performance characteristics of shielded enclosures: cables and boxes. Deriving and analyzing the transfer impedance, we will directly relate shield design to the electronic system EMC performance: emissions and immunity, crosstalk, biological safety. The effects of shield non-uniformities will be explained and quantified with regard to important wired and wireless electronic products.
- From Microns to Miles and from Chips to Ships
- Using Transfer Impedance as the Shield’s Figure of Merit
- Shield Design and Performance
- Solid Wall, Foil, Spiral, Braid, Mesh Shielding
- Multilayer Shields
- Shielding versus Crosstalk and Radiation
- UTP versus STP
- Shielding in Static, Induction, and Radiation Fields
- Enclosure and Aperture Resonances
- Wireless and “Mobile” Product Shielding
Workshop: Designing an On-Board PCB Shielding
Wednesday
Expanding Shielding Understanding
Building on case studies, we will establish the rationale for open parallel compensation shielding, explain its physical mechanisms, and
develop design techniques for shielding: from chips to PCBs to test sites. The classical image theory and simulations will provide an elegant and persuasive illustration and convenient formulas to design such shielding, evaluate its performance and impairment effects.We will introduce the complete shielding classification, provide a comparison between the different shielding techniques, and generalize the shielding theory.
- Ground/Power Planes and Lines/Traces as Shields
- Separation versus Parallel Shielding
- Open Parallel Shielding Rationale
- Method of Images and Current Returns
- Shielding and Balancing
- Finite Size Planes, Edge Effects, Cuts, and Vias
- Shielding Classes, Paradigms, Topologies, and Dimensions
- Transfer Function of Parallel Shields
- Shield Effectiveness versus Shielding Effectiveness
Optional Problem Workshop: Ground Plane Effect on Common and Differential Mode Emissions; Shield Reaction on Signal Transmission; Steel and Copper in Multilayer Shields – Not a Simple Problem
Thursday
Shielding System Engineering and Integration
We will introduce system approach to cost effective and optimal shielding design based on-specific electrical, physical, mechanical, and economical factors with regard to selected design criteria. We start the discussion with shielding system grounding techniques and problems: single- and multiple-point grounding, ground loops, shield termination – connectors, gaskets, doors, windows, joints. We will formulate, implement, and illustrate by simulations and test results the rules of shielding system grounding, topology, and zoning. We will develop shielding design criteria and methods for boundary
and optimal design, compare shielding with alternative EMI control techniques. At the Workshop, we will evaluate the dependence of a line radiation on the shield quality, grounding, and shielded circuit balance.
- Shielding, Grounding, and All That Jazz
- System Approach to Electrical and Mechanical Shield Design
- Shielding Optimization
- Working with Shielding Impairments
- Shielding Performance Stability
- Issues and Control of Shielding Reaction on Transmission
Friday
Shielding Evaluation and Horizons
We will address the shielding measurements, troubleshooting, testing, and test result interpretations. We will review the shielding standards, shielding system evaluation levels, measurement criteria, and logistics, and detail the shielding measurement triangle: test facilities, and test instrumentation, and test procedure. There are multiple test procedures and practices in use throughout the world, and their correct selection can make a difference between the product marketing success and failure.
The course concludes with identifying shielding emerging applications, materials, technologies, and practices. Being more than 100 years old, shielding technology keeps accelerating, leading to amazing and important developments in EMC.
- Shielding Measurement Rationale
- Global versus Local Measurements
- Measuring Shielding Effectiveness
- Measuring Transfer Impedance
- Testing in Time Domain
- Test Result Correlation and Interpretation
- Modern Materials/Technologies and Novel Applications
- “Exotic” Shielding Designs and Technologies
- “Fancy” and ”Bogus” Shielding
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About the Lecturer
Anatoly TSALIOVICH,
Ph.D, founder of ATInternational - a research, consulting, education, and testing company, West Windsor, USA.
Dr. Tsaliovich's expertise covers a wide range of electrical, electronics, and electromagnetic disciplines. He has served in various capacities in hi-tech telecom, computer, consumer electronics, and medical companies and organizations in the USA and world-wide, including AT&T, Belden, Thomas & Betts, Diabetex International, Russian Telecom, and many others.
Dr. Tsaliovich consults and conducts original research in the areas of new and emerging technologies and standards, participates in component and system design and optimization, and helps his clients to solve complex EMC and shielding-related problems. He is an author of 8 technical books, numerous award-winning papers, and patents. He chaired the Technical Programs and International Technical Advisory committees for International and national EMC Symposiums, organized and led standard development groups and activities. He is recipient of Richard R. Stoddard Award.
Dr. Tsaliovich has been a member of the CEI-Europe faculty since 1996. |
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Further Information
- Date : The next Public presentation is To be advised
- Regular Course Fee: EUR 2995 per student (or equivalent in Local Currency). Payment in advance via Credit Cards (PayPal or Google Checkout below), Cheque or bank transfer (ask for transfer details).
- Early Registration Course Fee: EUR 2725 This applies to firm registrations received 2 months before course start.
- University Student and Faculty Rate: Two university participants are welcome to attend for one course fee if payment is to be made from university funds.
- Deliverables: The course fee covers tuition, course material, and the day conference packages (morning/afternoon refreshments, lunches, etc.) paid on your behalf to the course venue. Accommodation is not included.
- Payment: No attendance is allowed unless payment has been received before the start of the course.
- Venue : Europe
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