PHYSICS OF FAILURE Training Course

This course offers an introductory understanding of some of the key engineering accelerated test techniques needed to develop reliable electronic products.

About this course.

Participants are presented with various physics of failure methods to provide design and test for reliability, and they will . . .
• Learn how products really fail and understand key reliability issues.
• Become acquainted with the failure modes and mechanisms associated with various electronic devices and assemblies.
• Determine the stresses associated with the assessment of reliable electronic equipment and examine techniques to address problems of reliability.
• Investigate the usage and applicability of reliability standards and handbooks.
The content of this course is complementary to the HALT and HASS seminars.

Course Content

Why Do Electronics Really Fail?
Do the Old Standards Do the Job?

The Physics of Failure Approach

• Stress Analysis Approaches
• Failure Models
• Case Studies
  • Ball Grid Array Interconnect Reliability
  • Vias and PTHs
  • Conductive Filament Formation
  • Wire Bond Failures in Glob-Top Chip-On-Board Packages

PoF Approach for Accelerated Qualification

• The 5-Step Approach for Accelerated Life Testing
• Virtual Qualification and Stress Margins
• Acceleration Transforms
• Testing and Data Post-Processing
• Case Studies:
  • Combined Thermal Cycling and Vibration
  • Vibration and Mechanical Shock
  • Combined Thermal Cycling and Vibration
  • Combined Temperature and Humidity

The PoF Approach for Process Verification Testing

• Types of Screens:
  • Non-Destructive Screens
  • Proof Tests
  • Accelerated Wearout Screens
• The two-step approach for Screening

Summary

Who should attend

This course is intended for those who are involved in the design, analysis, material selection, manufacture and test of microelectronic components, printed circuit/wiring boards and assemblies.
Participants will receive an understanding of the various reliability tradeoffs in electronic packaging.

About the Lecturer

DR. ABHIJIT DASGUPTA co-director of CALCE EPRC and faculty member at the University of Maryland, is an expert on physics-of-failure of electronic assemblies and interconnects and on methods to reduce cycle time for developing and qualifying electronic packaging. He has published widely, organized numerous conferences and workshops, and has served as an associate editor for the ASME Journal of Electronic Packaging.

Further Information

• Duration: Two days
• Assessment: This course is a non-assessed short course.
• Dates + Venue: The next Public presentation is :
  • 20-21 October, 2008 - New York, USA
• Price : £680 + VAT (where applicable) per delegate. Fees include course materials, tuition, refreshments and lunches. The price does not include accommodation.
• Registration: On line course registration can be completed, including secure payment via a credit card, by using either the PayPal or Google Checkout "Buy Now" buttons below right.
  To register with any other form of payment simply click on the "CLICK HERE without using a Credit Card " below left and follow the instructions.

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