This "lead-free" training course provides an extensive coverage of lead-free attachment reliability issues and trends, and offers practical guidelines to assess the reliability of "lead-free" solder joints and circuit board assemblies.
This seminar provides an extensive coverage of "lead-free" attachment reliability issues and trends and offers practical guidelines to assess the reliability of "lead-free" solder joints and circuit board assemblies. Participants will gain an in-depth understanding of the multitude of material, design and manufacturing parameters that affect solder joint reliability and that are critical to the deployment of "lead-free" circuit board assemblies. Following a review of the basics of solder joint mechanics, test procedures, failure modes and mechanisms, the seminar puts in perspective a wide range of "lead-free" data, material properties, test and modeling results from across the industry. Test results are discussed for common components (leadless, leaded, BGA, Flip-Chip, CSPs), including the effect of board and component finish on lead-free reliability, and a comparison of tin-lead, mixed assemblies and "lead-free" reliability data. Metallurgical risks, creep properties and fatigue curves are examined that explain differences in the reliability of tin-lead and "lead-free" assemblies. Examples of strain-energy based life prediction models and acceleration factors are presented, comparing test efficiency for SAC and SnPb assemblies and illustrating how to extrapolate "lead-free" test results to product use conditions, the true measure of "lead-free" assembly reliability.
The tutorial is technical in nature and pulls together a wide range of data, material properties, test and modeling results from across the industry. Lessons learned from the tin-lead experience and fundamental differences between SnPb and "lead-free" solders are highlighted as well as recent progress in the practical understanding of "lead-free" solder joint reliability.
Pre-requisites: none although some basic understanding of the mechanical behavior of materials is helpful. In addition to the printed seminar hand-out, participants will receive the .pdf version of an extensive reference list on SnPb and "lead-free" solder joint reliability.
The basics of solder joint reliability, plus an overview of trends in SAC vs. SnPb accelerated testing results.
Fundamentals and lessons learned from the SnPb experience:
solder joint mechanics,
creep-fatigue interaction,
life prediction techniques.
Assembly quality and reliability: defects and their impact on product life.
Accelerated testing procedures, failure modes and mechanisms, failure statistics.
Identify potential risk areas (metallurgical risks, ductile-to-brittle transition, interfacial failures...).
How to plan for "lead-free" product reliability assurance and why inferior test results — when compared to SnPb -- do not necessarily imply lessened product reliability.
Gain an understanding of fundamental differences in microstructure, creep mechanisms and the thermo-mechanical response of SnPb and SAC alloys.
Understand the effect of thermal cycling dwell times on the relative lives of SnPb and SAC assemblies.
Find out how to optimize "lead-free" accelerated thermal cycling profiles for maximum efficiency (and reduced cost) without lengthening test duration.
How to interpret test results; strain-energy based life prediction models; examples of acceleration factors for SAC assemblies, including validation data.
This "Lead-Free" training course will benefit design, materials, manufacturing, quality or reliability professionals and managers who are responsible for, or plan to implement "lead-free" assembly technologies in their companies and products.
Dr. Jean-Paul Clech - has over 20 years of practical experience in SMT design, soldering quality and reliability assurance. He maintains one of the largest databases of solder joint reliability data, material properties and life prediction models in the industry and is constantly challenged by problems brought about by new and emerging technologies. His current research interests are in BGA, CSP, flip-chip and "lead-free" assembly reliability, including the development of "lead-free" solder acceleration factors and life prediction models.
Jean-Paul is the founder of EPSI Inc. in Montclair, NJ. His responsibilities include technical consultation and problem solving for clients across the electronics industry worldwide, and the development of engineering tools and training programs to prevent or solve reliability problems in electronic packages and board assemblies. He is the principal developer of the "Solder Reliability Solutions" model and application software. He has also served as an expert-witness in product litigations involving solder joint field failures.
Price: £680 + VAT(where applicable) per delegate. Fees include course materials, tuition, refreshments and lunches. The price does not include accommodation.
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A Division of EMC Resources 
Dr. Jean-Paul Clech - has over 20 years of practical experience in SMT design, soldering quality and reliability assurance. He maintains one of the largest databases of solder joint reliability data, material properties and life prediction models in the industry and is constantly challenged by problems brought about by new and emerging technologies. His current research interests are in BGA, CSP, flip-chip and "lead-free" assembly reliability, including the development of "lead-free" solder acceleration factors and life prediction models.
