Practical Design of Wireless Digital Communications Systems Training Course |
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| This 3-day Wireless Design course focuses on the practical design and development of modern radio frequency (RF) and wireless communications circuits and systems using common digital modulation standards. |
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About the Training Course |
| In today’s ultra-competitive global wireless industry, the design-to-production cycle is of crucial importance. However, developing modern wireless products, such as 3G cellular telephones, Wi-Fi and WiMAX systems, presents many challenges. Advanced skills and knowledge are required not only to architect these systems and devise suitable circuit topologies, but also to solve the challenging integration and manufacturability issues associated with high-volume products. This course teaches the practical aspects of developing robust RF and wireless designs suitable for high-volume production. |
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Who is this training course for? |
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The course is aimed at engineers, technicians and engineering managers working in the wireless communications industry. The audience typically includes RF engineers and technicians working in research and development, manufacturing test and production environments and systems engineers responsible for the architecture of RF communications systems. The course will also be of interest to managers who oversee these groups.
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Training Course Content |
Digital Modulation Fundamentals
◆ System Link Block Diagram: Modulation, Tx, Channel, Rx, Demodulation
◆ Why Digital? Resistance to Fading, Voice vs. Packet Data, Capacity
◆ IQ Modulation Representation: Constellation, Eye Diagram Display Formats
◆ BPSK, QPSK, MSK, Properties of Gaussian and RRC Filtering, Concept of ISI
◆ Channel Characteristics, Diversity, Fading Types, Mitigation Techniques, Spread Spectrum, OFDM, Equalisation and Training
◆ Definitions of TDMA, FDMA and CDMA
◆ TDD and FDD
Common Modulation Standards and Implications for RF Implementation
◆ Constant Envelope Modulation Examples: Bluetooth and GSM
◆ Non-Constant Envelope Modulation: EDGE, W-CDMA, LTE, IS-95, CDMA2000 etc., WiMAX 802.16 Family, 802.11a/b/g Wireless LAN, Bluetooth, GPS
Transceiver System Considerations
◆ Common RF System Components: Amplifiers, Mixers, Filters, etc.; Imperfections - Distortion and Noise
◆ Transceiver Architectures and Trade-offs: Frequency Planning; Analysis of Cascaded Blocks; TDD and FDD Considerations
◆ Transceiver Architectural Examples: GSM Example, Bluetooth Example, 3GPP Example, Transmitter Linearisation
RF Component-level Measurements
◆ Linear Measurements: Power, S-Parameters (including Balanced Devices), Group Delay, Noise Figure, Phase Noise
◆ Nonlinear Measurements: Intermodulation, Load-Pull, EVM, ACP, AM-AM and AM-PM Calculated from IQ Measurements
◆ Two-Tone Intermodulation
◆ ACP: GSM and W-CDMA Measurement Examples
◆ Modulation Accuracy: EVM, RMS, Peak, 95th Percentile
◆ Measurement Uncertainty Properties of Small EVMs
◆ Load-Pull: Source and Load Plane Contours of Gain, Efficiency, ACP and EVM
Receiver Measurements
◆ Analysis of Cascaded Blocks
◆ BER: Bit Errors, Block Errors, Frame Erasure, Sync Errors, Typical Measurement System, Loopback Mode
◆ Sensitivity Definitions, eg. 1E-3 BER Point
◆ Receiver Blocking Mechanisms
◆ Selectivity Measurements
◆ Spurious Response Measurements
◆ Measurement Techniques: Analogue IF/IQ/RSSI Level Sweep with Interferer
Transmitter Measurements
◆ Spurious Emissions: Tx Noise in Rx bBand, Harmonics and Mixing Products
◆ Transient Behaviour: Power-Time Response, Frequency Spectrum due to Power Burst, Frequency Kick due to Power Ramping
◆ ACP: Modulation and Power Switching Transients
◆ Modulation Accuracy - EVM
◆ Code Domain Power and PCDE
Fabrication Technologies
◆ PCB Types
◆ Etching Tolerances, Board Layer Construction, Vias/Drill Sizes, Thermal Reliefs, Implications for RF Performance
◆ TDR Characterisation
RF System Integration
◆ Choosing PCB Layer Structures
◆ Grounding Strategies
◆ Coupling Between Components
◆ Floorplanning: Placing Components to Maximse Isolation
◆ Shielding/Screening, Gaskets, Effectiveness
◆ Mismatches when Cascading Filters and Amplifiers, Pulling and Buffering
◆ Tolerancing/Yield
◆ Thermal and Electrical Derating for Reliability
Integration of RF and Baseband
◆ Processor Clock Signals in Receivers
◆ System Planning to Avoid Harmonics at Specific Frequencies
◆ Reference Spurs on VCOs
◆ ‘Hot’ Supply Lines and Control Lines: Effect on the System
The Design Verification Process
◆ What to Test and Look for at Each Prototype Iteration
◆ Integration Do’s and Don’ts
◆ Minimising the Number of Prototype Iterations Required
◆ Automated Design Verification Testing
Case Studies
◆ GSM (GMSK and EDGE)
◆ W-CDMA
◆ DECT
◆ FSK
◆ PWT Products
Course Information |
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Learning Outcomes |
Upon completion of this course, you will be able to:
- Describe common digital modulation standards and modulation formats
- Explain the component-level measurements required to characterise digital modulation systems
- Explain the system-level measurements required to characterise digital modulation systems
- List the key features, strengths and weaknesses of common transceiver architectures
- Specify the key measurements for digital receivers and transmitters
- Identify the effects of PCB layout on system performance
- Use best practices to minimise PCB layout-related problems
- Understand integration risks and use verification methods to validate digital modulation systems
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Business Benefits |
The course will deliver the following business benefits:
- Reduced design and development times and costs
- Improved design and development efficiency
- Improved design quality and system performance
- Reduced development and project risks
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About the Lecturer |
Chris Potter
Consultant, Cambridge RF Limited, Cambridge, UK.
Chris Potter is a consultant with Cambridge RF in Cambridge, UK. He has over 20 years experience in the design and development of radio frequency (RF) and microwave circuits and systems for a wide range of wireless communications applications.
Since 1998, he has worked on the design and development of RF systems for terminals and cellular infrastructure. He is particularly interested linear power amplifiers (PAs), adaptive PA linearization techniques, integration of RF-baseband hardware and the development of tools for automation of the RF design process.
Dr. Potter received the BSc degree in Electronics in 1983 from the University of York, UK and the PhD degree in 1987 from the University of London, UK. From 1983 to 1995, he worked on the design and development of microwave and RF test equipment at Marconi Instruments, UK. From 1995 to 2002, he was Chief RF Technologist at Symbionics/Tality, UK, developing RF architectures and product designs for GSM, GSM-EDGE, W-CDMA, Bluetooth and 802.11a/b.
Chris Potter is currently Managing Director at Cambridge RF Limited and a Director of Aphena Limited, developers of the SoftPlot application. He has taught advanced RF, wireless and microwave design courses and provided consulting services worldwide. |
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Further Information |
- Date : The next Public presentation is Thursday 20-22 January 2009
- Prerequisites : A good understanding of RF and wireless design and development.
- Course Level - Intermediate: Intermediate level assumes the delegate has general knowledge of the subject and professional experience of the specific areas covered.
- Price : Regular: £1475.00 + VAT (£258.13) = £1733.13 per attendee
Early: £1325.00 + VAT (£231.88) = £1556.88 per attendee
The early rate applies to all enrolments received 8 weeks prior to the course start date. The course fees apply to each person attending the course. Please note that the cost of accommodation is not included in the fees.
- What’s Included?
The course includes a set of high-quality bound course notes, refreshments mid-morning and mid-afternoon and a gourmet buffet lunch on each day of the course. The optional Mercedes-Benz World tour and exhibition is also included.
- Venue : Weybridge, Surrey UK
- Registration: On line course registration can be completed, including secure payment via a credit card, by using either the PayPal or Google Checkout "Buy Now" buttons below right.
To register with any other form of payment simply click on the "CLICK HERE without using a Credit Card " below left and follow the instructions.
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